具有激光功率自动补偿功能
可打标高翘曲产品，翘曲度≤10mm
具有上下相机图像融合功能， 可以实时监测打标位置，具有打标自检功能
具有振镜自动校准，自动偏移补偿， 铁环晶圆中心补偿功能
最小打标字高是0.1mm
Equipped with laser power automatic compensation function
Can be used for elevation warping products, with a warping degree of ≤ 10mm
Equipped with image fusion function for upper and lower cameras, capable of real-time monitoring of marking positions, and with marking self inspection function
Equipped with automatic scanner calibration , automatic offset compensation, and iron ring wafer center compensation functions
Minimum marking character height is 0.1mm
参数配置
功能描述
适用产品： 8英寸、 12英寸裸晶圆、 带膜晶圆、 6英寸带膜晶圆（可根据客户要求定制）
主要功能：实现晶圆芯片背面微小字符激光标记功能
进出料方式： Load port、Ring Frame
尺寸：L2770 * W1460 * H1900mm
Applicable products: 8-inch, 12-inch mirror wafers, coated wafers, and 6-inch coated wafers (customizable according to customer requirements)
Main function: To achieve laser marking of small characters on the back of wafer chips
Import and export method: Load port , Ring Frame
